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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Šefara, Petr ; Otáhal, Alexandr (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature proles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the inuence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Vala, Martin ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the influence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature profiles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the influence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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Investigation of Reliability for Solder Joints
Toufar, Michal ; Somer, Jakub (referee) ; Szendiuch, Ivan (advisor)
It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the quality of solder joints due to a defined residual oxygen during the soldering proces. According finishes used on the resulting quality connections for two types of lead free solder.
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Investigation of Reliability for Solder Joints
Toufar, Michal ; Somer, Jakub (referee) ; Szendiuch, Ivan (advisor)
It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the quality of solder joints due to a defined residual oxygen during the soldering proces. According finishes used on the resulting quality connections for two types of lead free solder.
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Vala, Martin ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the influence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature profiles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the influence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.
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|
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Šefara, Petr ; Otáhal, Alexandr (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature proles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the inuence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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